| 发明名称 |
METHOD FOR APPLYING A TEMPORARY BONDING LAYER |
| 摘要 |
A method for applying a temporary bonding layer to a carrier wafer for temporary joining to a product wafer by fusion bonding or anodic bonding, said method comprising:
applying a temporary bonding layer which is suitable for fusion bonding or anodic bonding to the carrier wafer andmodifying the temporary bonding layer during and/or after application such that the temporary connection of the temporary bonding layer can be broken. |
| 申请公布号 |
US2015047784(A1) |
申请公布日期 |
2015.02.19 |
| 申请号 |
US201314388107 |
申请日期 |
2013.12.16 |
| 申请人 |
EV GROUP E. THALLNER GMBH |
发明人 |
Burggraf Jurgen |
| 分类号 |
H01L21/673;C25D5/48;C23C16/56;C23C16/01;C23C16/40 |
主分类号 |
H01L21/673 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for applying a temporary bonding layer to a carrier wafer for temporary bonding to a product wafer by fusion bonding or anodic bonding, said method comprising:
applying a temporary bonding layer which is suitable for fusion bonding or anodic bonding to the carrier wafer and modifying the temporary bonding layer during and/or after application such that the temporary bonding of the temporary bonding layer can be broken. |
| 地址 |
ST. FLORIAN AM INN AT |
