发明名称 |
COVER FOR ELECTRONIC DEVICE, ANTENNA ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A cover for an electronic device may include a metal plate having a first metal region formed of a metal; a through-hole formed in a portion of the first metal region of the metal plate; and an electrical open path extending from the through-hole to an end portion on one side of the first metal region through metal oxidation. |
申请公布号 |
US2015050968(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
US201414459194 |
申请日期 |
2014.08.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEON Dae Seong;KIM Jong Lae;CHOI Kang Ryong |
分类号 |
H04M1/02;C25D5/02 |
主分类号 |
H04M1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A cover for an electronic device, the cover comprising:
a metal plate having a first metal region and a second metal region formed of a metal; an electrical open path formed in the metal plate, and configured to electrically separate the first metal region and the second metal region from each other; and an antenna radiation part arranged in the second metal region. |
地址 |
Suwon-Si KR |