发明名称 CMP PADS HAVING MATERIAL COMPOSITION THAT FACILITATES CONTROLLED CONDITIONING
摘要 <p>Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.</p>
申请公布号 WO2015023442(A1) 申请公布日期 2015.02.19
申请号 WO2014US48902 申请日期 2014.07.30
申请人 APPLIED MATERIALS, INC. 发明人 BAJAJ, RAJEEV;BOHN, CRAIG E.;REDEKER, FRED
分类号 H01L21/30 主分类号 H01L21/30
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