发明名称 |
CMP PADS HAVING MATERIAL COMPOSITION THAT FACILITATES CONTROLLED CONDITIONING |
摘要 |
<p>Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.</p> |
申请公布号 |
WO2015023442(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
WO2014US48902 |
申请日期 |
2014.07.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BAJAJ, RAJEEV;BOHN, CRAIG E.;REDEKER, FRED |
分类号 |
H01L21/30 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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