| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of warpage in a core substrate.SOLUTION: Core substrates (31a, 31b) having films (100a, 100b) stuck to their second surfaces are arranged so that surfaces of the core substrates (31a, 31b) to which the films (100a, 100b) are not stuck face each other. A support (120) is arranged between structures (110a, 110b). Further, an insulator (131a) is arranged between the structure (110a) and the support (120), and an insulator (131b) is arranged between the structure (110b) and the support (120). Then, they are pressurized to be laminated. The insulators (131a, 131b) enter openings of the core substrates (31a, 31b) to fix electronic components (40a, 40b). Further, the insulators (131a, 131b) are cured to form insulating layers covering first surfaces of the core substrates (31a, 31b). Then, the films (100a, 100b) are peeled from the core substrates (31a, 31b). |
