SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

摘要

Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.

主权项

1. A method of forming a semiconductor package comprising:
providing a carrier having a conductive surface; forming a first dielectric layer on the conductive surface of the carrier, the first dielectric layer having a die cavity exposing a die region on the conductive surface; forming a layer of adhesive on the die region of the conductive surface; attaching a die onto the layer of adhesive, the die having a back side secured to the layer of adhesive, and a front side having a plurality of die pads; depositing a second dielectric layer onto the first dielectric layer and the die; forming a plurality of die interconnects on the plurality of die pads at the front side of the die; and removing the carrier to expose the layer of adhesive.