发明名称 COMPOSITE COPPER PARTICLES AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide composite copper particles exhibiting improved electrode continuity while maintaining a sintering commencement temperature comparable to sintering temperatures of conventionally used copper powders.SOLUTION: The composite copper particles of the present invention are provided by compositing, with a flat copper particle, a plurality of inorganic oxide particles finer than the flat copper particle. The inorganic oxide particles are localized on surfaces of the flat copper particle. The volume cumulative diameter Dspecific to cumulative volume=50 vol.% according to a laser diffraction scatter-style particle size distribution measurement method is preferably 0.1 μm or above and 10 μm or below. The aspect ratio expressed by d/t, namely the flat particle surface major axis diameter d-to-thickness t ratio, is preferably 5 or above and 30 or below.
申请公布号 JP2015034309(A) 申请公布日期 2015.02.19
申请号 JP20130164445 申请日期 2013.08.07
申请人 MITSUI MINING & SMELTING CO LTD 发明人 KODAIRA TOSHIHIRO;SASAKI NOBUHIRO;MINOWA HIKARI
分类号 B22F1/00;B22F1/02;C22C9/00;C22C9/01;C22C9/10;H01B1/00;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F1/00
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