FILM-LIKE POSITIVE TYPE PHOTOSENSITIVE ADHESIVE COMPOSITION, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film-like positive type photosensitive adhesive composition that can exhibit adequate flowability in the connection of semiconductor chips with each other or the connection of a semiconductor chip with a supporting member for mounting a semiconductor chip and is excellent in pattern formability, reflow resistance and connectivity.SOLUTION: The film-like positive type photosensitive adhesive composition comprises (A) an alkali-soluble resin and (B) a compound generating an acid by light and is used as an underfill material in a semiconductor device in which a connection part in each of connection of semiconductor chips with each other or connection of a semiconductor chip with a support member for mounting a semiconductor chip is electrically connected. The alkali-soluble resin (A) includes a polyimide resin having a phenolic hydroxyl group or a polyamide resin having a phenolic hydroxyl group.