| 摘要 |
Provided are a surface-treated copper powder and a metal powder that exhibit superior sinter delay properties and are suitable for use in the manufacture of electrodes for multilayer ceramic capacitor chips. The surface-treated metal powder has an N (nitrogen) content of at least 0.02 wt% relative to the surface-treated metal powder, and satisfies the formulas 50 ≤ x ≤ 1500 and y ≥ 0.2x + 600, in which x is the coating mass per 1 g of metal powder of one element selected from the group consisting of Al, Si, Ti, Zr, Ce, and Sn, and in which y (°C) is the starting temperature of sintering. Also provided is a method for producing the powders. |
