THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE COMPRISING THERMAL INTERFACE MATERIAL LAYER

摘要

Provided are a thermal interface material layer and a package-on-package device comprising a thermal interface material layer. The package-on-package device may comprise a thermal interface material layer arranged between an upper semiconductor package and a lower semiconductor package, and configured to have specific physical properties. Therefore, when performing solder ball welding to install the upper semiconductor package on the lower semiconductor package, cracking within the lower semiconductor chip can be prevented.