发明名称 ELONGATED CAPACITIVELY COUPLED PLASMA SOURCE FOR HIGH TEMPERATURE LOW PRESSURE ENVIRONMENTS
摘要 <p>A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.</p>
申请公布号 WO2015023945(A1) 申请公布日期 2015.02.19
申请号 WO2014US51274 申请日期 2014.08.15
申请人 APPLIED MATERIALS, INC.;FORSTER, JOHN C.;YUDOVSKY, JOSEPH;KWONG, GARRY K;NGO, TAI T.;GRIFFIN, KEVIN;COLLINS, KENNETH S.;LIU, REN 发明人 FORSTER, JOHN C.;YUDOVSKY, JOSEPH;KWONG, GARRY K;NGO, TAI T.;GRIFFIN, KEVIN;COLLINS, KENNETH S.;LIU, REN
分类号 H01L21/205;H01L21/02 主分类号 H01L21/205
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