发明名称 LIGHT EMITTING ELEMENT MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting element which has a configuration capable of achieving length equalization of a resonator.SOLUTION: A light emitting element manufacturing method comprises the steps of: (a) forming a mask layer 12 for selective growth on a light emitting element manufacturing substrate 11 in a region 14 outside an element formation region 13; subsequently (b) forming on the element formation region 13, a laminate structure 20 in which a first compound semiconductor layer 21, an active layer 23 and a second compound semiconductor layer 22 are stacked; subsequently (c) forming a second electrode 32 and a second light reflection layer 42 on the second compound semiconductor layer 22; subsequently (d) fixing the second light reflection layer 42 to a support substrate 26; subsequently (e) removing the light emitting element manufacturing substrate 11 to expose a first surface of the first compound semiconductor layer and the mask layer 12; and subsequently (f) forming a first light reflection layer 41 and a first electrode 31 on the first surface of the first compound semiconductor layer 21.</p>
申请公布号 JP2015035543(A) 申请公布日期 2015.02.19
申请号 JP20130166572 申请日期 2013.08.09
申请人 SONY CORP 发明人 KAZETAGAWA MUNEYUKI;HAMAGUCHI TATSUFUMI;KURAMOTO MASARU
分类号 H01S5/183;H01S5/042;H01S5/323 主分类号 H01S5/183
代理机构 代理人
主权项
地址