发明名称 METAL SUBSTRATE MANUFACTURING METHOD, AND METAL SUBSTRATE AND LEAD FRAME MANUFACTURED BY THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal substrate suppressed in warpage and in the crack of an insulation layer on the metal substrate surface, and a metal substrate and a lead frame obtained by the manufacturing method.SOLUTION: There is provided a method for manufacturing a metal substrate 1 having a metal layer 2 and an insulation layer 3 disposed on one face of the metal layer 2 and formed of metal oxide powder by an aerosol deposition method. This aerosol deposition method comprises: an arranging step of arranging a filming nozzle 22 for injecting metal oxide powder, and the metal layer 2 in a manner to confront at a spacing; and an injecting step of injecting the metal oxide powder from the filming nozzle 22 toward the metal layer 2. At the injecting step, the metal layer 2 or the filming nozzle 22 is moved such that the relative speed between the metal layer 2 and the filming nozzle 22 in the direction to intersect the injecting direction may be 0.1 to 100 mm/second.</p>
申请公布号 JP2015034320(A) 申请公布日期 2015.02.19
申请号 JP20130165416 申请日期 2013.08.08
申请人 NITTO DENKO CORP 发明人 MINAMIKATA MASAYUKI
分类号 C23C24/04;H01L23/50 主分类号 C23C24/04
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