SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD

摘要

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

主权项

1. A polishing apparatus comprising:
a wafer holder configured to hold a wafer; a top ring comprising a top ring body and a retainer ring; a ring supporter configured to support the retainer ring when the wafer is transferred from the wafer holder to the top ring and/or when the wafer is transferred from the top ring to the wafer holder; and a polishing table configured to polish the wafer transferred to the top ring.