| 发明名称 |
LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME |
| 摘要 |
Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate. |
| 申请公布号 |
US2015050761(A1) |
申请公布日期 |
2015.02.19 |
| 申请号 |
US201314394501 |
申请日期 |
2013.04.19 |
| 申请人 |
Rensselaer Polytechnic Institute |
发明人 |
Karlicek Robert F.;Lu James Jian-Qiang;Goodwin Charles Sanford;Tkachenko Anton |
| 分类号 |
H01L25/075 |
主分类号 |
H01L25/075 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of assembling an array of light emitting diode (LED) dies on a substrate comprising:
positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto a front side of a substrate using magnets that are arranged at pre-determined locations either directly on the backside of the substrate or near the backside of the substrate; and forming permanent electrical and/or mechanical connections between the dies and the substrate thereby constituting an array of LED dies on a substrate. |
| 地址 |
Troy NY US |
