FABRICATING THERMAL TRANSFER STRUCTURE(S) AND ATTACHMENT MECHANISM(S) FOR COOLING ELECTRONICS CARD(S)

摘要

Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

主权项

1. A method comprising:
fabricating a cooling apparatus, the fabricating comprising:
providing a thermal transfer structure configured to couple to at least one side of an electronics card comprising one or more electronic components to be cooled, the electronics card operatively docking within a socket of an electronic system, and the thermal transfer structure comprising:
a thermal spreader configured to couple to the at least one side of the electronics card; andat least one coolant-carrying channel associated with the thermal spreader for removing heat from the thermal spreader to coolant flowing through the at least one coolant-carrying channel;positioning a coolant manifold structure adjacent to the socket of the electronic system within which the electronics card is to operatively dock; andproviding a fluidic and mechanical attachment mechanism which selectively, fluidically and mechanically couples or decouples the thermal transfer structure and coolant manifold structure, the fluidic and mechanical attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the at least one coolant-carrying channel of the thermal transfer structure.