| 发明名称 |
PATTERNED PROCESSING KITS FOR MATERIAL PROCESSING |
| 摘要 |
Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing. |
| 申请公布号 |
US2015047563(A1) |
申请公布日期 |
2015.02.19 |
| 申请号 |
US201313968633 |
申请日期 |
2013.08.16 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
CHUNG CHEN-FANG;Tseng Chih-Tsang;Lee Hsiao-Chuan;CHUANG KUO-PIN;Tseng Shuen-Liang |
| 分类号 |
C23C16/04;C23C16/44 |
主分类号 |
C23C16/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for material processing, the apparatus comprising:
a process-kit component including a first groove and a second groove, the first groove and the second groove being disposed to form a pattern on a surface of the process-kit component; wherein the process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing. |
| 地址 |
Hsinchu TW |
