发明名称 BACKSHEET FOR RIGID PHOTOVOLTAIC MODULES
摘要 PROBLEM TO BE SOLVED: To provide a backsheet material that has good adhesion to an encapsulant, good electric insulation, mechanical strength, and moisture blocking.SOLUTION: A backsheet comprises a coextruded multilayer sheet that comprises: i) an inner layer comprising a polyolefin resin; ii) a core layer comprising a polypropylene resin, a blend of a polypropylene resin and a maleic anhydride grafted polypropylene (MAH-g-PP), or a polypropylene resin/MAH-g-PP multilayer structure; iii) an outer layer comprising a maleic anhydride grafted polyvinylidene fluoride (MAH-g-PVDF), a blend of a polyvinylidene fluoride (PVDF) and a MAH-g-PVDF, or a PVDF/MAH-g-PVDF multilayer structure; iv) a first tie layer between the core layer and the outer layer; and v) an optionally used second tie layer between the core layer and the inner layer.
申请公布号 JP2015035613(A) 申请公布日期 2015.02.19
申请号 JP20140204869 申请日期 2014.10.03
申请人 DOW GLOBAL TECHNOLOGIES LLC 发明人 CHU LIH-LONG;CHEN XUMING
分类号 H01L31/049;B29C47/06;B32B27/30;B32B27/32 主分类号 H01L31/049
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