| 发明名称 |
CONTROLLING THE MELT FRONT OF THIN FILM APPLICATIONS |
| 摘要 |
Systems and methods for bonding include selectively heating an initial location of a sample to melt a bonding layer at an interface between a first layer and a second layer of the sample. The heating is propagated in a direction away from the initial location such that a melt front of the bonding layer is translated across the interface to provide a void free bond between the first layer and the second layer. |
| 申请公布号 |
US2015048145(A1) |
申请公布日期 |
2015.02.19 |
| 申请号 |
US201314025269 |
申请日期 |
2013.09.12 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Bedell Stephen W.;Ott John A. |
| 分类号 |
B23K3/04;B23K37/00;B23K37/06 |
主分类号 |
B23K3/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for bonding, comprising:
a controller configured to control a plurality of heating elements to selectively heat an initial location of a sample to melt a bonding layer at an interface between a first layer and a second layer of the sample, and propagate the heating in a direction away from the initial location such that a melt front of the bonding layer is translated across the interface to provide a void free bond between the first layer and the second layer. |
| 地址 |
Armonk NY US |
