PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD DESIGN PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board which prevents deterioration in waveform quality in a transmission line in the case where semiconductor elements having similar shapes are mounted on both surfaces of a substrate.SOLUTION: A printed circuit board comprises: a substrate; a first semiconductor element mounted on a first surface of the substrate; and a second semiconductor element which is mounted on a second surface of the substrate opposite to the first surface and has a shape similar to that of the first semiconductor element. Positions of a first side of the first semiconductor element and a first side of the second semiconductor element approximately correspond to each other on the substrate. A position of a second side of the first semiconductor element opposite to the first side and a position of a second side of the second semiconductor element opposite to the first side lie away from each other on the substrate.