Apparatus And Method For Bonding A Plurality Of Semiconductor Chips Onto A Substrate

摘要

An apparatus and a method for bonding semiconductor a plurality of semiconductor chips to a substrate are provided. The apparatus comprises a frame; a plurality of bond heads coupled to the frame, each bond head being operable to obtain and release a chip; and a bond stage coupled to the frame and operable to receive a substrate; each bond head of the plurality of bond heads being relatively moveable with respect to the bond stage and operable to contact a chip obtained by the bond head with a substrate received on the bond stage and to release the chip to bond the chip to the substrate