发明名称 RECTENNA DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a rectenna device capable of easily be downsized, increasing received power, and simplifying a manufacturing process.SOLUTION: A metal foil 3 with a thin film is configured by forming a thin film 2 that exerts rectification by Schottky junction on a surface of a metal foil 1. The rectenna device is formed by laminating a plurality of layers of metal foil 3 with a thin film and has each function of micro wave power receiving, rectification, and smoothing.
申请公布号 JP2015035895(A) 申请公布日期 2015.02.19
申请号 JP20130165774 申请日期 2013.08.09
申请人 NICHICON CORP 发明人 MUTSUYAMA KOICHI;MORI HITOSHI
分类号 H02J17/00;H01Q1/38;H01Q23/00 主分类号 H02J17/00
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