| 摘要 |
PROBLEM TO BE SOLVED: To easily and efficiently prevent occurrence of sparking (discharge) near a wafer surface when performing electrical characteristic inspection of a semiconductor device at a wafer level.SOLUTION: In a probe device, a spark prevention mechanism 50 includes an enclosing member 52 which encloses probe needles 26S, 26G between a probe card 16 and a placement stand 12, and a gas supply mechanism 54 which, when inspection for electrical characteristic is performed for each chip (power device) on a semiconductor wafer W, so that an atmosphere having a predetermined pressure higher than the atmosphere is formed around the probe needles 26S, 26G, supplies gas around the probe needles 26S, 26G by way of the vicinity or the interior of the enclosing member 52. A contact plate 34 also acts as the enclosing member 52. |
