PACKAGE ASSEMBLY FOR CHIP AND METHOD OF MANUFACTURING SAME

摘要

A package assembly includes a substrate, a chip located on the substrate, solder balls, pads, an encapsulation and separating posts corresponding to the pads one by one. The chip is electrically connected to the pads via the solder balls, and is encapsulated by the encapsulation. The separating posts extend from the edge of the corresponding pads in a direction away from the pads. The solder balls are accommodated in the separating posts to avoid a short connection between any two adjacent solder balls. A method of manufacturing the package assembly is also provided.

主权项

1. A package assembly for a chip, the package assembly comprising:
a substrate; a pad located on the substrate, a hollow post extending from the substrate at an edge of the pad in a direction away from the substrate, the post surrounding the pad; a solder ball located on the pad in the hollow post, the solder ball electrically connected to the pad; a chip electrically connected to the pad via the solder ball; and an encapsulation encapsulating all of the pad, the solder ball and the chip on the substrate therein.