发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
In one embodiment, a semiconductor package includes a circuit substrate, a plurality of semiconductor chips stacked on the circuit substrate, insulating adhesive patterns interposed between the semiconductor chips, a heat slug provided on an uppermost semiconductor chip and adhered to the uppermost semiconductor chip by a heat dissipative adhesive pattern, and a mold structure provided on the circuit substrate to cover sidewalls of the semiconductor chips, the insulating adhesive patterns, the heat dissipative adhesive pattern and the heat slug. A failure of the semiconductor package during a manufacturing process of the mold structure may be reduced. The semiconductor package may therefore have good operating characteristics and reliability. |
申请公布号 |
US2015048493(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
US201414318643 |
申请日期 |
2014.06.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MIN Tae-Hong;JEE Young-Kun;CHO Tae-Je |
分类号 |
H01L23/00;H01L23/538;H01L23/373 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
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主权项 |
1. A semiconductor package, comprising:
a circuit substrate; a plurality of semiconductor chips stacked on the circuit substrate; insulating adhesive patterns interposed between the semiconductor chips; a heat slug provided on an uppermost semiconductor chip and adhered to the uppermost semiconductor chip through a heat dissipative adhesive pattern; and a mold structure provided on the circuit substrate to cover sidewalls of the semiconductor chips, the insulating adhesive patterns, the heat dissipative adhesive pattern and the heat slug. |
地址 |
Suwon-si KR |