| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder alloy for a high temperature which has a melting point of about 300°C-400°C suitable to be used by an assembly or the like of an electronic part, is excellent in wettability, bondability, processability, and reliability, does not contain Pb, and makes Zn a principal ingredient. <P>SOLUTION: The Pb free solder alloy making Zn a principal ingredient includes: 0.01-9.0 mass% of Al; at least one of Ge, Mg, Ag, and P in ranges of 0.01-8.0 mass% of Ge, 0.01-5.0 mass% of Mg, 0.1-4.0 mass% of Ag, and at most 0.5 mass% of P; and a remainder of Zn and inevitable impurities, and is characterized in that an oxide layer of an alloy surface is at most 120 nm, and a surface roughness Ra is at most 0.60μm. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
