发明名称 ウエハ移載装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wafer transfer device in which a wafer can be prevented from being broken by accurately transferring the wafer and a wafer transfer method. <P>SOLUTION: The wafer transfer device includes a wafer chuck part which holds the wafer, a wafer guide part equipped with a guide member to guide the wafer to a predetermined placing position, and a body part which holds the wafer chuck part and a wafer guide part so that the wafer and the guide member held by the wafer chuck part are opposed to each other in the drop direction of the wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5670645(B2) 申请公布日期 2015.02.18
申请号 JP20100103933 申请日期 2010.04.28
申请人 发明人
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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