发明名称 両面研磨装置
摘要 In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe.
申请公布号 JP5671735(B2) 申请公布日期 2015.02.18
申请号 JP20110007407 申请日期 2011.01.18
申请人 不二越機械工業株式会社 发明人 宮下 忠一;小山 翔悟
分类号 B24B37/08;B24B37/00 主分类号 B24B37/08
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