| 摘要 |
<p>The device has a resin case receiving a printed circuit board (PCB) (2a). A connector (4a) electrically connects the board with outer side of the resin case by a cable. A high potential spacer and a low potential spacer are provided on the board to connect a LSI (1a). A bypass capacitor (BC1) is inserted between the spacers and provided in a surrounding area of the connector. Island-shaped conductive patterns (Pa-Pd) are provided on the board. An output terminal of the LSI is connected to the island-shaped conductive patterns. The high potential spacer is a power supply line (VCC) of the LSI, and the low potential spacer is a ground line (GND) of the LSI.</p> |
