发明名称 電子部品接合構造
摘要 PROBLEM TO BE SOLVED: To provide an electronic component joining structure in which an electric component lead is joined by caulking to a bus bar for wiring.SOLUTION: Since flux is not required to be used, and air bubbles are not generated by melting of the flux even if used during high temperature, thereby capable of preventing a junction from being damaged by expansion of the air bubbles. If a support piece and a bent piece are formed at the tip of a bus bar via a fitting recess, a lead 31 is fitted into the fitting recess, and the tip of the bent piece is caulked so as to be wound around the peripheral edge of the lead by bending the bent piece, caulking joining can be performed by simple work.
申请公布号 JP5672549(B2) 申请公布日期 2015.02.18
申请号 JP20110121700 申请日期 2011.05.31
申请人 株式会社日本ロック 发明人 森 和弘
分类号 H01L23/50;H01L23/04;H05K1/18 主分类号 H01L23/50
代理机构 代理人
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