发明名称 金属ガラス層への導線の接合方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of bonding a conductor wire to metal glass which can stably bond a conductor wire to a metal glass layer. <P>SOLUTION: In bonding a conductor wire 2 to a metal glass substrate 1 that is a metal glass layer, the conductor wire 2 is pressed against a bonding surface 1a of the metal glass substrate 1 and then ultrasonic energy is given to the conductor wire 2 from an ultrasonic tool 3 to bond the conductor wire 2 to the metal glass substrate 1. When an Al-based bonding wire is used as the conductor wire 2, a wedge tool is used as the ultrasonic tool 3. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5671213(B2) 申请公布日期 2015.02.18
申请号 JP20090044049 申请日期 2009.02.26
申请人 パナソニック株式会社;国立大学法人東北大学;竹本 正;西川 宏 发明人 佐名川 佳治;久保 雅男;酒井 孝昌;竹本 正;西川 宏;福原 幹夫;井上 明久
分类号 H01L21/607;H04R19/00 主分类号 H01L21/607
代理机构 代理人
主权项
地址