| 摘要 |
<P>PROBLEM TO BE SOLVED: To supply a highly reliable circuit board at low costs. <P>SOLUTION: For example, a metal mask 100 with openings 101 therebetween covers a substrate 1 so that the portions of the surface of the substrate 1 that include the chip lead-out electrodes 2 are exposed, a metal conductor is formed on an ionized cladding metal by means of ion plating that applies a cladding energy of 0.01 to 250 eV, and thereafter, a wiring layer 21 is formed comprising a metal conductor formed on a portion of the surface of the substrate 1 by means of detaching the metal mask 100. As a result, it is possible to provide a circuit board with high production characteristics and low cost since it is possible to directly form the wiring layer 21 on the substrate without using photo-lithography. Furthermore, the circuit board and the other chips are laminated, and they are connected by a bonding wire. <P>COPYRIGHT: (C)2011,JPO&INPIT |
