| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having low thermal expansibility, high glass transition temperature and low dielectric property, excellent with good balance in all of copper foil adhesiveness, soldering heat resistance, heat resistance with copper, flame retardancy and drilling property, also excellent in low toxicity, safety or work environment, and suitable for electronic components or the like; and to provide a prepreg, a laminate, a bismaleimide derivative having polyazomethine used for the resin composition, and a method for producing the derivative. <P>SOLUTION: This invention relates to the bismaleimide derivative having polyazomethine having a structure shown by general formula (I), a method for producing the same, the thermosetting resin composition containing the bismaleimide derivative, and the prepreg and the laminate using the same. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
