| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress curving of a heating plate caused by sealing of a driving IC with the use of thermosetting resin. <P>SOLUTION: The thermal print head includes a heat sink 20, the heating plate 30, a holding plate 50, a circuit substrate 60, the driving IC 62 and a sealing body 70. The heating plate 30 has a glaze layer 36, a resistor layer 38 and a conductor layer 40 stacked together on a supporting substrate 34 made of ceramic. The heating plate 30 is placed on a surface of the heat sink 20. The holding plate 50 is made of ceramic, and is arranged with the heating plate 30 in a sub scanning direction 92 on the surface of the heat sink 20. The circuit substrate 60 is fixed on the holding plate 50. The driving IC 62 is placed on the circuit substrate, and is electrically connected to a circuit formed on the circuit substrate 60 and an electrode formed on the heating plate 30. The sealing body 70 is made of the thermosetting resin, covers the driving IC 62, and integrally bonds the heating plate 30, the circuit substrate 60 and the holding plate 50. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
