| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package substrate for mounting a semiconductor element which is capable of making a fine and adhesive external circuit because undercut hardly occurs, improving a yield by suppressing adhesion of resin powder when an insulation layer is laminated, and ensuring reliability of connection with the semiconductor element because unevenness is hardly generated on a surface of the external circuit. <P>SOLUTION: A method of manufacturing a package substrate for mounting a semiconductor element comprises: a step of making a core substrate by preparing a multilayer metal foil in which a first carrier metal foil, a second carrier metal foil, and a base metal foil are laminated and laminating the multilayer metal foil on a substrate; a step of physically exfoliating the first carrier metal layer of the multilayer metal foil; a step of performing pattern-plating on the second carrier metal foil; a step of making a laminate by laminating an insulation layer on the pattern plating; a step of separating the laminate with the second carrier metal foil from the core substrate; and a step of removing the second carrier metal foil of the separated laminate. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
