发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus comprising:
a polishing pad having a polishing surface;
a top ring body configured to press a substrate against said polishing surface;
a retainer ring (502) configured to press said polishing surface, said retainer ring being provided at a peripheral portion of said top ring body;
a pusher (800) operable to receive the substrate from and deliver the substrate to said top ring body; and ·
a retainer ring wear detector (840) for detecting wear of said retainer ring, said retainer ring wear detector being provided in said pusher. |
申请公布号 |
EP2838110(A1) |
申请公布日期 |
2015.02.18 |
申请号 |
EP20140188224 |
申请日期 |
2005.10.31 |
申请人 |
EBARA CORPORATION |
发明人 |
NABEYA, OSAMU;TOGAWA, TETSUJI;FUKUSHIMA, MAKOTO;YASUDA, HOZUMI |
分类号 |
H01L21/304;B24B37/005;B24B37/04;B24B37/10;B24B37/30;B24B37/32;B24B47/22;B24B49/00;B24B49/16 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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