发明名称 Polishing apparatus
摘要 A polishing apparatus comprising: a polishing pad having a polishing surface; a top ring body configured to press a substrate against said polishing surface; a retainer ring (502) configured to press said polishing surface, said retainer ring being provided at a peripheral portion of said top ring body; a pusher (800) operable to receive the substrate from and deliver the substrate to said top ring body; and · a retainer ring wear detector (840) for detecting wear of said retainer ring, said retainer ring wear detector being provided in said pusher.
申请公布号 EP2838110(A1) 申请公布日期 2015.02.18
申请号 EP20140188224 申请日期 2005.10.31
申请人 EBARA CORPORATION 发明人 NABEYA, OSAMU;TOGAWA, TETSUJI;FUKUSHIMA, MAKOTO;YASUDA, HOZUMI
分类号 H01L21/304;B24B37/005;B24B37/04;B24B37/10;B24B37/30;B24B37/32;B24B47/22;B24B49/00;B24B49/16 主分类号 H01L21/304
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