Photocurable composition and encapsulated apparatus prepared using the same

摘要

Disclosed herein is a photocurable composition and the encapsulated apparatus prepared using the same. The photocurable composition has A/B of 0.7 kgf/% or more and A of 2.5 kgf or more when A indicates glass-metal alloy die shear strength (unit: kgf) after curing between a glass substrate and a Ni/Fe alloy and B indicates curing shrinkage (unit: %).