发明名称 BACKSIDE ILLUMINATED IMAGING SENSOR WITH BACKSIDE P+ DOPED LAYER
摘要 <p>A backside illuminated imaging sensor includes a semiconductor layer having a P-type region. A frontside and backside P+ doped layers are formed within the semiconductor layer. An imaging pixel having a photodiode is formed within the semiconductor layer, where the photodiode is an N−region formed within the P-type region of the semiconductor layer between the frontside P+ doped layer and the backside P+ doped layer.</p>
申请公布号 EP2245666(B1) 申请公布日期 2015.02.18
申请号 EP20080872239 申请日期 2008.12.23
申请人 OMNIVISION TECHNOLOGIES, INC. 发明人 NOZAKI, HIDETOSHI;RHODES, HOWARD, E.
分类号 H01L27/146 主分类号 H01L27/146
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