| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excelling in flame retardancy and moldability.SOLUTION: The epoxy resin composition used for coating, insulating or sealing an electric component, an electronic component or an integrated circuit contains, as essential components, epoxy resin (A) expressed by a predetermined general formula, phenol resin ((B) and (C)) expressed by predetermined general formulas, a curing accelerator (D), and an inorganic filler (E), wherein the weight ratio [(B)/(C)] of (B) to (C) is 1-10. |
