发明名称 METHOD FOR MANUFACTURING A SIC SUBSTRATE WITH SIC EPITAXIAL FILM
摘要 A method of forming an epitaxial SiC film on SiC substrates in a warm wall CVD system, wherein the susceptor is actively heated and the ceiling and sidewall are not actively heated, but are allowed to be indirectly heated by the susceptor. The method includes a first process of reaction cell preparation and a second process of epitaxial film growth. The epitaxial growth is performed by flowing parallel to the surface of the wafers a gas mixture of hydrogen, silicon and carbon gases, at total gas velocity in a range 120 to 250 cm/sec.
申请公布号 EP2837020(A1) 申请公布日期 2015.02.18
申请号 EP20140721146 申请日期 2014.03.15
申请人 DOW CORNING CORPORATION 发明人 LOBODA, Mark, J.;ZHANG, Jie
分类号 H01L21/20;C30B25/10;C30B25/20;C30B29/36 主分类号 H01L21/20
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