SEMICONDUCTOR DEVICE, DIE ATTACH MATERIAL, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor device (10) comprising: a substrate (1); an adhesive layer (2); and a light emitting diode chip (3), in which the adhesive layer (2) is a cured product of a die attach material, and the die attach material contains at least one resin component (A) selected from the group consisting of a compound (A1) represented by the following formula (1) and an acrylate compound (A2) which has a cycloalkylene group and two or more (meth) acrylic groups and does not have an aromatic ring in one molecule, a silane coupling agent (B), and an inorganic filler (C).
(wherein X represents an oxygen atom or a nitrogen atom; m and n each independently represent 0 or 1; R 1 , R 2 , R 3 , and R 4 each independently represent a hydrogen atom or an organic group not having an aromatic ring; at least two of R 1 , R 2 , R 3 , and R 4 each independently represent an organic group having a (meth)acrylic group.)