| 发明名称 | Device substrate and fabrication method thereof | ||
| 摘要 | A fabricating method of a device substrate including the following procedures is provided. First, a substrate is provided and a patterned structure is formed on the substrate, wherein the patterned structure includes a plurality of openings. Then, a protective layer is formed on the patterned structure, wherein the protective layer does not fully fill the openings of the patterned structure such that a gap is existed between the protective layer and the patterned structure. Later, a device layer is formed on the protective layer. | ||
| 申请公布号 | US8957505(B2) | 申请公布日期 | 2015.02.17 |
| 申请号 | US201313781778 | 申请日期 | 2013.03.01 |
| 申请人 | Au Optronics Corporation | 发明人 | Wang Cheng-Liang;Hung Shih-Hsing;Hwu Keh-Long |
| 分类号 | H01L29/06;H01L23/00;H01L21/02;H01L21/48 | 主分类号 | H01L29/06 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A device substrate, comprising: a flexible substrate; a patterned structure configured on the flexible substrate, and the patterned structure comprising a plurality of openings, wherein an aspect ratio of the plurality of openings of the patterned structure is greater than 1; a protective layer, configured on the patterned structure, wherein the protective layer does not completely fill the plurality of openings of the patterned structure to provide air gaps between the protective layer and the patterned structure, and the patterned structure comprises an organic material and the protective layer comprises an inorganic material; and a device layer, configured on the protective layer. | ||
| 地址 | Hsinchu TW | ||