Chip package and method of manufacturing the same

摘要

A package includes a semiconductor device including an active surface having a contact pad. A redistribution layer (RDL) structure includes a first post-passivation interconnection (PPI) line electrically connected to the contact pad and extending on the active surface of the semiconductor device. An under-bump metallurgy (UBM) layer is formed over and electrically connected to the first PPI line. A seal ring structure extends around the upper periphery of the semiconductor device. The seal ring structure includes a seal layer extending on the same level as at least one of the first PPI line and the UBM layer.

主权项

1. A package, comprising:
a semiconductor device comprising a die, and including an active surface having a contact pad; a redistribution layer (RDL) structure including a first post-passivation interconnection (PPI) line electrically connected to the contact pad and extending on the active surface of the semiconductor device; an under-bump metallurgy (UBM) layer over and electrically connected to the first PPI line; and a seal ring structure extending around and outside an upper periphery of the die, the seal ring structure including a seal layer extending on a same level as at least one of the first PPI line and the UBM layer, wherein
the seal ring structure includes a top seal layer extending on the same level as and spaced apart from the UBM layer,the seal ring structure further includes a lower seal layer connected to the top seal layer, and extended on the same level as the first PPI line,the semiconductor device further includes a chip seal ring having a seal contact pad, andthe lower seal layer is in contact with the seal contact pad.