| 发明名称 | LED package and fabrication method of the same | ||
| 摘要 | An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip. | ||
| 申请公布号 | US8957448(B2) | 申请公布日期 | 2015.02.17 |
| 申请号 | US201213433356 | 申请日期 | 2012.03.29 |
| 申请人 | Sungkyunkwan University Foundation for Corporate Collaboration | 发明人 | Suh Su Jeong;Park Haw Sun |
| 分类号 | H01L33/00;H01L33/48;H01L33/64 | 主分类号 | H01L33/00 |
| 代理机构 | NSIP Law | 代理人 | NSIP Law |
| 主权项 | 1. An LED package, comprising: an insulation plate; a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity; an LED chip configured to be mounted directly on the insulation plate inside the cavity; an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin; a through-hole configured to be formed on the insulation plate where the LED chip is mounted, wherein the through-hole enables portions of the LED chip to be exposed; and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip. | ||
| 地址 | Suwon-si KR | ||