发明名称 Method for producing ferroelectric thin film
摘要 A method for producing a ferroelectric thin film comprising: coating a composition for forming a ferroelectric thin film on a base electrode of a substrate having a substrate body and the base electrode that has crystal faces oriented in the (111) direction, calcining the coated composition, and subsequently performing firing the coated composition to crystallize the coated composition, and thereby forming a ferroelectric thin film on the base electrode, wherein the method includes formation of an orientation controlling layer by coating the composition on the base electrode, calcining the coated composition, and firing the coated composition, where an amount of the composition coated on the base electrode is controlled such that a thickness of the orientation controlling layer after crystallization is in a range of 35 nm to 150 nm, and thereby controlling the preferential crystal orientation of the orientation controlling layer in the (100) plane.
申请公布号 US8956689(B2) 申请公布日期 2015.02.17
申请号 US201213471796 申请日期 2012.05.15
申请人 Mitsubishi Materials Corporation 发明人 Watanabe Toshiaki;Sakurai Hideaki;Soyama Nobuyuki;Doi Toshihiro
分类号 B05D5/12;B32B9/04;H01L49/02;H01L21/02;H01L41/08;H01L41/319;H01L21/28 主分类号 B05D5/12
代理机构 Edwards Wildman Palmer LLP 代理人 Edwards Wildman Palmer LLP ;Armstrong, IV James E.;DiCeglie, Jr. Nicholas J.
主权项 1. A method for producing a ferroelectric thin film comprising: forming a ferroelectric thin film on a base electrode of a substrate having a substrate body and the base electrode that has crystal faces oriented in the (111) direction, wherein the formation of the ferroelectric thin film includes performing formation of an orientation controlling layer by a process including coating a composition for forming the ferroelectric thin film on the base electrode, performing calcination of the coated composition, and subsequently performing firing of the coated composition to crystallize the coated composition, where an amount of the composition for forming the ferroelectric thin film coated on the base electrode is controlled such that a thickness of the orientation controlling layer after crystallization is in a range of 35 nm to 150 nm, and thereby controlling the preferred orientation of crystals of the orientation controlling layer in the (100) plane, and wherein the method further comprises forming a crystal diameter controlling layer on the base electrode before forming the orientation controlling layer, wherein the orientation controlling layer is formed on the crystal diameter controlling layer and the crystal diameter of the orientation controlling layer is equal to the crystal diameter of the crystal diameter controlling layer as a result.
地址 Tokyo JP