Accessing or interconnecting integrated circuits

摘要

Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

主权项

1. An apparatus comprising:
a first integrated circuit, comprising a two-dimensional first I/O arrangement of conductive first input/output structures of like respective areas, A, on the first integrated circuit that are configured to respectively carry distinct signals; an interconnection structure, overlaying the two-dimensional first I/O arrangement, the interconnection structure comprising a two-dimensional second I/O arrangement of conductive second input/output structures of respective areas, B, that are configured to respectively carry distinct signals, wherein the area B is larger than the area A; and wherein the first integrated circuit includes a programming circuit to select which of the plurality of conductive input/output structures underlying one of the second input/output structures of the interconnection structure electrically conductively communicates using that one of the second input/output structures.