发明名称 Inlays for security documents
摘要 Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.
申请公布号 US8955759(B2) 申请公布日期 2015.02.17
申请号 US201314062846 申请日期 2013.10.24
申请人 Féinics AmaTech Tearanta 发明人 Finn David
分类号 G06K19/00;B42D15/00;B32B37/12;G06K19/02;G06K19/067;G06K19/073;G06K19/077;H01Q1/22;H01Q1/38;H01Q1/40;H01Q7/00;B32B38/10;H01L23/00 主分类号 G06K19/00
代理机构 代理人 Linden Gerald E.
主权项 1. A method of making a secure document comprising an inlay substrate, comprising: providing the inlay substrate as at least two layers of a synthetic material laminated to one another with a layer of adhesive; and providing a recess for a chip module in the substrate; futher comprising: disposing ferrite particles in at least one of the layers.
地址 Lower Churchfield, Teurma Ready, Co. Mayo IE