System and method for cleaning a wafer chuck

摘要

A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.

主权项

1. A device comprising:
a wafer chuck configured to rotate on a first axis of rotation during a wafer chuck cleaning process; a cleaning cap configured to overlie and align with the wafer chuck, the cleaning cap including:
a base,a first roller connected to the base and having wound therearound a cleaning cloth;a second roller connected to the base and having attached thereto a free end of the cleaning cloth, such that the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis, wherein the cleaning cloth is configured to rotate on a second axis of rotation during the wafer chuck cleaning process, and wherein the second axis of rotation is orthogonal to the first axis of rotation; anda solvent orifice within the cleaning cap and configured to deliver a solvent directly to the cleaning cloth such that the solvent is applied to the wafer chuck by the cleaning cloth; a spring mechanism connecting the first and second rollers to the cap, such that the spring mechanism can maintain the first and second rollers pressed against the wafer chuck; and a manipulator configured to position the cleaning cap onto the wafer chuck such that the cleaning cloth comes into contact with a surface of the wafer chuck.