Solid state power source with frames for attachment to an electronic circuit

摘要

A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

主权项

1. A device, comprising:
an electronic circuit having a substrate with a first side and a second side; a first frame and a second frame; a first side encapsulant region and a second side encapsulant region positioned between the first and second frames; a first battery having a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second frames, and between the first and second side encapsulant regions, wherein the first and second frames electrically and mechanically contact the electronic circuit on the first side of the substrate.