Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board

摘要

The present invention has an objective to provide a circuit board for a peripheral circuit which can transmit outside heat which generates from a high exothermic element, such as a power semiconductor element, while attaining reduction in size and weight, reduction in surge, and reduction in a loss, in high-capacity modules including power modules, such as an inverter.;[Solution Means] In a high-capacity module, by laminating a peripheral circuit using a ceramic circuit board with electrode(s) constituted by thick conductor and embedded therein on a highly exothermic element, overheating of the module is prevented by effective heat dissipation via the circuit board while attaining reduction in size and weight, reduction in surge, and reduction in a loss in the module.

主权项

1. A circuit board for a second electronic circuit that is laminated on a side of a first electronic circuit on which a high exothermic element is disposed wherein:
said circuit board comprises a substrate, which comprises at least one dielectric layer mainly comprising ceramics, and at least one first surface electrode formed on a first side of said circuit board that faces said first electronic circuit, at least a part of said first surface electrode is embedded inside of said substrate, a remaining part of said first surface electrode is exposed outside of said circuit board for said second electronic circuit and defines a major portion of said first side of said substrate that faces said first electronic circuit such that a portion of a first surface of said first surface electrode is opposed to at least one terminal of said high exothermic element, and the thickness of said first surface electrode is not less than 100 micrometers in a direction perpendicular to said first surface.