Technology of reducing radiation noise of semiconductor device

摘要

A first lead frame group is constituted by a plurality of lead frames that are connected to the first circuit, terminals of the plurality of lead frames being provided on a first side of the semiconductor device. A second lead frame group is constituted by a plurality of lead frames that are connected to the second circuit, terminals of the plurality of lead frames being provided on a second side of the semiconductor device. A suspension lead for suspending a die pad that supports the semiconductor chip, the suspension lead being arranged from a corner portion that is formed by the first side and the second side toward the semiconductor chip. Among a group of the terminals of the first lead frame group that are provided on the first side, a terminal on the corner portion side is a terminal for inputting or outputting a signal with a high frequency.

主权项

1. A semiconductor device, comprising:
a first circuit including connection terminals configured to input or output a signal, wherein said first circuit is configured to operate at a first frequency; a second circuit separated from said first circuit and including connection terminals configured to input or output a signal, wherein said second circuit is configured to operate at a second frequency lower than said first frequency; a semiconductor chip including said first circuit and said second circuit; a first lead frame group that is constituted by a first plurality of lead frames that are connected to said first circuit, terminals of said plurality of lead frames being provided on a first side of the semiconductor device; a second lead frame group that is constituted by a second plurality of lead frames that are connected to said second circuit, terminals of said second plurality of lead frames being provided on a second side of the semiconductor device; and a suspension lead configured to suspend a die pad that supports said semiconductor chip, said suspension lead being arranged from a corner portion that is formed by said first side and said second side toward said semiconductor chip, wherein a group of the terminals of said first plurality of lead frames that are provided on said first side includes a terminal that is arranged closer to the corner portion than to a center portion of said first side and that is a terminal configured to input or output a signal with a high frequency.